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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17.feb.2015 rev.002 tsz22111 ? 14 ? 001 www.rohm.com 3.5v to 14v, 0 .8 a 1ch synchronous buck converter integrated mosfet bd8312h fn general description bd8312hfn can produce 1.2v, 1.8v, 3.3v, or 5v step ped -down output voltages from a power supply composed of 4 batteries, which can be li2cell, li3cell, or from a 5v/12v fixed power supply line. the built-in synchronous rectification switches are capable of withstanding up to15v. this ic has a flexible phase compensation system and a switching frequency of 1.5mhz allowing the use of smaller external output ind uctor and capacitor making the construction of a compact power supply really easy. features ? built-in 1.0a/15v pch/nch synchronous rectification sw ? on -chip phase compensation device between input and output of error amp. ? built-in soft-start function. ? bui lt -in timer latch system for short circuit protection function. application for portable equipments like dsc/dvc powered by 4 dry batteries or li2cell and li3cell, or general consumer-equipment with 5v/12 v lines key specifications ? i nput voltage range: +3.5v to + 14v ? output voltage range: +1.2v to + 12v ? output current: 0 .8 a(max) ? switching frequency: 1.5mhz(typ) ? pch fet on-resistance: 450m(typ) ? nch fet on-resistance: 300m(typ) ? standby current: 0 a( typ ) ? operating temperature range: -25 c to +85c package w (typ) x d (typ) x h (ma x) typical application circuit input: 4.5v to 10v, output: 3.3v / 500ma figure 1 . typical application circuit hson8 2.90mm x 3.00mm x 0.60mm v bat =4.5v to 10v l x datashee t
2 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn pin configuration pin description block diagram pin no. pin name function 1 gnd ground pin 2 vcc supply voltage input pin for control circuit 3 vreg 5v o utput terminal of regulator for internal circuit 4 pgnd power switch ground pin 5 lx power switch terminal for external c oil 6 pvcc supply voltage input pin for power switches 7 stb on/off pin 8 inv error amp input pin figure 3. block diagram vcc inv vreg pgnd gnd stb pvcc figure 2. pin configuration ( top view ) l x
3 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn descripti on of blocks (1) reference this block p roduces the 1.0v internal reference voltage of the error amp. (2) 5v r eg this block produces a 5v regulated voltage supply for the internal analog circuit. bd8312hfn is equipped with this regulator for the purpose of prot ecting the internal circuit from high voltages. the output of this block de creases when v cc is less than 5v, increasing the pmos on - 5hvlvwdqfhdqgghfuhdvlqjwkh'&'&frqyhuwhu?vsrzhuhiilflhqf\dqg maximum output current (please see data in figure 15, 1 6, 17 and 18). (3) uvlo this circuit prevents malfunction of the internal circuit during activation of the power supply voltage or during low power supply voltage. it monitors the vcc pin voltage, turns off all output fet and dc/dc converter output, and rese ts the timer latch of the internal scp circuit and soft - start circuit when v cc voltage becomes lower than 2.9v. typical uvlo hysteresis is 200 mv. (4) scp scp is a timer latch system for short circuit protection. when the dc/dc converter is at 100% duty, the internal scp circuit starts counting. the internal counter is in - sync with osc so that the latch circuit is activated to turn off the '&'&frqyhuwhu?vrxwsxwdiwhuderxwpvhfrudiwhuwkhfrxqwhufrxqwvderxwforfnsxovhv7ruhvhwwkhodwfk cir cuit, turn off the stb pin once, then, turn it on again. or, turn the power supply off and then on again. (5) osc circuit that generates oscillating saw - tooth waveform signal with a fixed frequency of 1.5 mhz. (6) error amp the error amplifier detects the outp ut signal and output pwm control signals. the internal reference voltage is set at 9$sulpdu\skdvhfrpshqvdwlrqghylfhris)n lvexlow - in between the inverting input terminal and the output terminal of this error amp. (7) pwm comp pwm comp i s the voltage - to - pulse - width converter for controlling the output voltage corresponding to the input voltage. it compares the internal slope waveform with the error amp output voltage, then controls the pulse width of the output to the driver. (8) soft start this circuit prevents inrush current during startup by gradually increasing the output voltage of the dc/dc converter.. soft - start time is in - sync with the internal osc so that the output voltage of the dc/dc converter reaches the set voltage after about 8000 oscillations. (9) pre driver/timing control cmos inverter circuit for driving the built - in synchronous rectification pch/nch fet switch. the synchronous rectification off time for preventing feed through is about 25 nsec. (10) stby_io voltage applied on s tb pin (7 pin) controls the on/off state of the ic. the ic is turned on when a voltage of 2.5v or higher is applied and turned off when the terminal is open or 0v is applied. a pull - down resistor which is approximately 400 n lvexlow - in. (11) pch/nch fet sw built - in synchronous rectification fet for switching the coil current of the dc/dc converter. the switch is a combination of a pch fet rated at 15v with r on ri p dqg d 1fk )(7 dovr udwhg dw 9 zlwk 5rq ri p sinc e the current rating of this fet is 1.0a, the output current including the ripple current of the coil should not exceed this limit.
4 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn absolute maximum ratings parameter symbol rating unit maximum applied power voltage v cc , pv cc 15 v maximum input current i inmax 1.0 a power dissipation pd 0. 6 3 (note 1) w operating temperature range topr - 25 to +85 c storage temperature range tstg - 55 to +150 c junction temperature tjmax +150 c (note 1 ) when used at ta = 25 c or more and installed on a 70 x 70 x 1.6 t mm board, the rating is reduced by 5.04mw/ c . caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is imp ortant to consider circuit protection measures, su ch as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions ( ta = 25 c ) parameter symbol rating unit power s upply v oltage v cc 3.5 to 14 v output v o ltage v out 1.2 to 12 v electrical characteristics ( unless otherwise specified, ta = 25 c , v cc = 7.4 v) parameter symbol limit unit condition s min typ max [ low v oltage i nput m alfunction p reventing c ircuit ] detection t hreshold v oltage v uv - 2.9 3.2 v v reg monitor hysteresis r ange ? v uvhy 100 200 300 mv [ oscillator ] oscillation f requency f osc 1.38 1.5 1.62 mhz [ regulator ] output v oltage v reg 4.65 5.0 5.35 v [ error amp ] inv t hreshold v oltage v inv 0.99 1.00 1.01 v input b ias c urrent i inv - 50 0 + 50 na v cc =12.0v , v inv =6.0v soft - start t ime t ss 3.2 5.3 7.4 msec [ pwm c omparator ] lx max duty d max - - 100 (note 1 ) % [ output ] pmos on - r esistance r onp - 450 600 m nmos on - r esistance r onn - 300 420 m leak c urrent i leak - 1 0 + 1 a [ stb ] stb pin c ontrol v oltage operation v stb h 2.5 - 11 v no - operation v stb l - 0.3 - + 0.3 v stb p in p ull - down r esistance r stb 250 400 700 k [ circuit c urrent ] standby c urrent v cc p in i stb 1 - - 1 a pv cc p in i stb 2 - - 1 a circuit c urrent at o peration v cc i cc1 - 600 900 a v inv =1.2v c ircuit current at operation p v c c i cc2 - 30 50 a v inv =1.2v (note 1 ) 100% is max duty as behavior of a pwm comparator . where in high side pmos is 100% at on state because the same or less input voltage than output voltage is supplied . this causes the scp t o activate and stop the operation of the dc/dc converter .
5 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn typical performance curves ( unless otherwise specified, ta = 25 c , v cc = 7.4v >' fig ure 4. inv threshold vs t emperature inv threshold [v] temperature [ c ] fig ure 5 . inv t hreshold vs p ower s upply voltage inv threshold [ v ] v cc [v] fig ure 6. vreg o utput vs temperature temperature [ c] v reg voltage [ v] fig ure 7. vreg o utput vs power s upply voltage v reg [v] v cc [v] 0 1 2 3 4 5 6 7 8 0 2 4 6 8 10 12 14 0.98 0.99 1.00 1.01 1.02 0 5 10 4.7 4.8 4.9 5.0 5.1 5.2 5.3 -40 0 40 80 120 0.98 0.99 1.00 1.01 1.02 -40 -20 0 20 40 60 80 100 120
6 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn typical performance curves C v ] environmental temperature ta [ c ] hysteresis voltage vhys [ v ] uvlo release voltage hysteresis width uvlo detection voltage i d =500ma figure11. nch fet on - resistance vs temperature nch on - resistance [ p? ] temperature [ c ] 100 200 300 400 500 -40 0 40 80 120 1.3 1.4 1.5 1.6 1.7 -40 0 40 80 120 1.3 1.4 1.5 1.6 1.7 3 6 9 12 15 2.50 2.70 2.90 3.10 3.30 3.50 -40 0 40 80 120 0.00 0.05 0.10 0.15 0.20 0.25
7 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn typical performan ce curves C 0 100 200 300 400 500 600 3 6 9 12 15 0 200 400 600 800 1000 3 6 9 12 15 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 1.0 2.0 0 200 400 600 800 -40 0 40 80 120
8 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn typical performance curves C 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 1.0 2.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 1.0 2.0 1.0 1.5 2.0 2.5 -50 0 50 100 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 1.0 2.0
9 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn typical performance curves - continued ( unless otherwise specified, ta = 25 c , v cc = 7.4 v) figure 20. circuit current i cc vs temperature temperature [ o c] i cc [a] figure 21. circuit current i cc vs v cc v cc [v] i cc [a] 0 200 400 600 800 1000 -40 0 40 80 120 0 200 400 600 800 1000 0 2 4 6 8 10 12 14
10 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn application information 1. e xample of a pplica tion input : 4.5 v to 10v, o utput : 3.3v / 500 ma 2. reference application data 1 figure 22. reference application diagram lx v bat =4.5 v to 10v 1 f 1 f 1 0 f 47 h fig ure 24 . load r egulation (v out = 3.3v) fig ure 23 . power c onversion e fficiency (v out = 3.3v) output current [ma] output voltage [v] v cc =4.5v v cc = 7 .5v v cc = 5 .5v output voltage [v] output current [ma] v cc =4.5v v cc = 5 .5v v cc = 7 .5v 0 20 40 60 80 100 1 10 100 1000 3.25 3.27 3.29 3.31 3.33 3.35 1 10 100 1000 vreg pgnd vcc gnd pvcc inv lx stb vbat=4.510v 1 f grm188b11a105ka61 murata 4.7 h 1098as-4r7mtoko 1 f grm188b11a105ka61 murata 10 f grm31cb11a106ka01 murata 51k 22k 200k 10k 10pf 3.3v/500ma on/off
11 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn 3. reference a pplication d ata 2 (input 4.5v, 6.0v, 8.4v, 10v, o utput 3.3v ) figure 2 5 . frequency r esponse 1 (v cc =4.5v, i o =250ma) frequency [hz] - 60 - 40 - 20 0 20 40 60 100 1000 10000 100000 1000000 gain [db] - 180 - 120 - 60 0 60 120 180 phase [deg] phase gain figu re 2 6 . frequency r esponse 2 (v cc =6.0v, i o =250ma) frequency [hz] - 60 - 40 - 20 0 20 40 60 100 1000 10000 100000 1000000 gain [db] - 180 - 120 - 60 0 60 120 180 phase [deg] gain phase figure 2 7 . frequency r esponse 3 (v cc =8.4v, i o =250ma) frequency [hz] gain [db] phase [deg] figure 2 8 . frequency r esponse 4 (v cc =10v, i o =250ma) frequency [hz] gain [db] phase [deg]
12 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn reference a pplication d ata 2 - continued (input 4.5v, 6.0v, 8.4v, 10v, o utput 3.3v ) figure 2 9 . frequency r esponse 5 (v cc =4.5v, i o =500ma) frequency [hz] gain [db] phase [deg] figure 30 . frequency r esponse 6 (v cc =6.0v, i o =500ma) frequency [hz] gain [db] phase [deg] figure 31 . frequency r esponse 7 (v cc =8.4v, i o =500ma) frequency [hz] gain [db] phase [deg] figure 32 . frequency r esponse 8 (v cc =10v, i o =500ma) frequency [hz] gain [db] phase [deg]
13 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn 4. reference board pattern (1) the heat sink on the rear should be a gnd trace of low impedance and at the same potential with the pgnd trace . (2) it is recommended to install a gnd pin not directly connected to the pgnd, as shown in the picture above. (3) make the patterns for vbat, lx and pgnd as wide as possible since these pat hs carry large current. 5. selection of parts for application (1) inductor a shielded inductor with low dcr (direct resistance component) that satisfies the current rating (current value , i peak as sh own in the equation below) is recommended. inductor values a ffect inductor ripple current, which cause s output ripple. ripple current can be reduced as the coil l value becomes larger and the switching frequency becomes higher. w here i l is the output ripple current . f is the switching frequency. as a guide, inductor ripple current should be set at about 20 % to 50% of the maximum input current. note: current iorzlqjlqwkhfrlowkdwlvodujhuwkdqwkhfrlo?vud ting will bring the coil into magnetic saturation, which may lead to lower efficiency or output oscillation. select an inductor with an adequate margin so that the peak current does not exceed the rated current of the coil. (2) output capacitor a ceramic capa citor with low esr is recommended for the output in order to reduce output ripple. there must be an adequate margin between the maximum rating and output voltage of the capacitor, taking the dc bias property into consideration. output ripple voltage is acquired by the following equation. setting must be performed so that output ripple is within the allowable ripple voltage. fig ure 33 . inductor c urrent ? i l ? ? ? ? ? ? ? ? ? ] [ 1 a f v v l v v in out out in i l ? ? ? ? ? ] [ 2 / a i i ipeak l out ? ? ? ? i l ] [ 2 1 v r i c f i v esr l o l pp ? ? ? ? ? ? ? ? ?
14 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn (3) output voltage setting the internal reference voltage of the error amp is 1.0v. output voltage is acquired by equ ation (4). (4) dc/dc converter frequency response adjustment system condition for stable application . the condition for feedback system stability under negative feedback is that the phase delay is 135 or less when gain is 1 (0db). since dc/dc converter application is sampled according to the switching frequency, the bandwidth g bw of the whole system (frequency at which gain is 0 db) must be controlled to be equal to or lower than 1 /10 of the switching frequency. in summary, the conditions necessary for the dc/dc converter are: - phase delay must be 135 or lower when gain is 1 (0 db). - bandwidth g bw (frequency when gain is 0 db) must be equal to or lower than 1/10 of the switchi ng frequency. to satisfy those two conditions , r 1 , r 2 , r 3 , c s and r s in fig ure 3 5 should be set as follows. (a) r 1 , r 2 , r 3 bd831 2 hfn incorporates phase compensation devices of r 4 n dqg& 2 =200pf. c 2 and r 1 , r 2 , and r 3 values decide the primary pole that determines the bandwidth of dc/dc converter. primary pole point frequency dc/dc converter dc gain using equations ( 5 ) and ( 6 ), the frequency f sw of point 0 db under limitation of the bandwidth of the dc gain at the primary pole point i s as shown below. it is recommended that f sw should be approx imately 10 khz. when load response is difficult, it may be set at approx imately 20 khz. in equation ( 7 ), r 1 and r 2 , which determine s the voltage value, will be in the ord er of vhyhudokxqguhgn ,idq appropriate resistance value this high is not available and routing may cause noise, the use of r 3 enables easy setting. fig ure 34 . setting of v oltage f eedback r esistance fb v out c 2 r 1 r 2 rs r 4 cs r 3 inside of ic (5 ) ( 6 ) ( 7 ) fig ure 35 . e xample of p hase c ompensation setting where: a is the error amp gain about 100db = 10 5 b is the oscillator amplification = 0. 5 v in is the input voltage v out is the output voltage ? ? ? ? ? 2 3 2 1 2 1 2 1 c r r r r r a fp ? ? ? ? ? ? ? ? ? ? ? ? ? vref 1.0 v vout error amp r1 r2 inv ] [ 0 . 1 ) ( 2 2 1 v r r r v o ? ? ? ? ? ? ? ? ? o in sw v v b r r r r r c gain dc fp f ? ? ? ? ? ? ? ? ? 1 2 1 3 2 1 2 1 2 ? o in v v b a gain dc ? ? ? 1
15 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn (b) cs and rs setting for dc/dc converter, the 2nd dimension pole point is caused by the coil and capac itor as expressed by the following equation. cout: output capacitor this secondary pole causes a phase rotation of 180. to secure the stability of the system, put a zero point in 2 places to perform compensation. zero point by built - in c r zero point by c s setting f z2 frequenc y to be half to two times as large as f lc provides an appropriate phase margin. it is desirable to set rs at about 1/20 of (r 1 +r 3 ) to cancel any phase boosting at high frequencies. th e se pole points are summarized in the figure below. the actual frequency property is different from the ideal calculation because of part constants. if possible, check the phase margin with a frequency analyzer or network analyzer. otherwise, check for the presence or absence of ringing by load response waveform and also check for the presence or absence of oscillation under a load of an adequate margin. ( 8 ) ( 9 ) ( 10 ) ( 8 ) ( 7 ) figure 3 6 . example of dc/dc c onverter f requency p roperty >& m easured with fra5097 by nf corporation >' ( 10 ) ( 9 ) ? ? s z c r r f 3 1 2 2 1 ? ? ? khz c r f z 13 2 1 2 4 1 ? ? ? ? ? lcout f lc ? 2 1 ?
16 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn i/o equivalen t circuit figure 37. i/o equivalent c ircuit stb inv l x , pgnd, pv cc v reg vcc v cc v reg vcc vcc v reg pv cc lx pgnd vcc stb vreg vcc inv lx pgnd pvcc vcc vreg vcc
17 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the powe r supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the d igital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single gr ound at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must b e as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceed ing this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obta ined . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to th e internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e le ctromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vsrzhuvxsso\ should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent da mage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentio nal solder bridge deposited in between pins during assembly to name a few.
18 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn operational notes C n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
19 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn ordering information b d 8 3 1 2 h f n - t r part number package hfn : h so n 8 packaging and forming specification tr: embossed tape and reel marking diagram hson8 (top view) 3 1 2 part number marking lot number 1pin mark b d 8
20 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn physical dimension , tape and reel information package name hson8
21 / 21 tsz02201 - 0q3q0nz00360 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. 17. feb.2015 rev.002 www.rohm.com tsz22111 15 001 bd8312hfn re vision history date revision changes 26 .nov .2014 001 new release 17.f e b.2015 002 correction of the writing.
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd8312hfn package hson8 unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes bd8312hfn - web page distribution inventory

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